A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor.
A first mounting electrodeA solid electric conductor through which an electric current enters or leaves in a medium to mount the multilayer ceramic capacitor is located on a first principal surface of the substrate, and a first external connection electrodeA solid electric conductor through which an electric current enters or leaves in a medium for connection to an external circuit board is located on a second principal surface.
A recess is located in a side surface of the interposer. A connecting conductor is located in the wall surface of the recess. The connecting conductor is located at a position spaced apart by a predetermined distance from the side surface of the interposer.